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Cleanroom Semiconductor Fabrication and Wafer Lithography Steppers

Architecting the Silicon of Tomorrow

Rooted in the philosophy of "Design • Innovate • Deliver", Power Silicon Technologies Pvt. Ltd. is an engineering-first semiconductor house dedicated to VLSI excellence and embedded integration.

Semiconductor Engineering with Rigor & Precision

Power Silicon (Power Silicon Technologies Pvt. Ltd.) is a premier Indian semiconductor engineering company headquartered in Hyderabad & Bengaluru, India. We deliver end-to-end VLSI architecture, custom ASIC/SoC micro-architecture, UVM verification, 2nm/3nm physical design signoff, analog layout, and embedded firmware.

With core engineering resources focused on Digital VLSI Design, Advanced Verification, and Physical Signoff, we partner with global fabless semiconductor companies, Tier-1 automotive OEMs, and hyper-scale innovators to tape out complex SoCs and ASICs on time with first-pass silicon precision.

Our dedicated Embedded Systems practice ensures that your silicon comes alive immediately with production-grade Board Support Packages (BSPs), device drivers, and post-silicon validation routines.

VLSI Engineering Embedded Systems

Our Vision

To be the trusted semiconductor design execution partner for the world's most critical compute, automotive, and artificial intelligence silicon.

Our Mission

To eliminate silicon risk and compress tape-out timelines through extreme verification depth, architectural rigor, and transparent engineering collaboration.

The Cornerstones of Our Practice

Every project at Power Silicon Technologies is governed by four immutable engineering commitments.

Technical Rigor in Silicon Engineering
Principle 01

Technical Rigor

No shortcuts. We enforce exhaustive linting, CDC/RDC checks, and 100% formal and functional coverage closure before signoff.

Zero Re-Spin Tape-Out Precision
Principle 02

Zero Re-Spin Policy

Tape-out respins cost millions. Our multi-corner STA signoff and silicon validation checklists guarantee first-pass functionality.

Strict IP Isolation & Secure Design Infrastructure
Principle 03

Strict IP Isolation

Complete client data segregation with military-grade network security, encrypted design servers, and robust legal NDA frameworks.

Flexible Delivery Models Turnkey & ODC
Principle 04

Flexible Delivery

From full turnkey design ownership to targeted ODC staff augmentation, we adapt seamlessly to your engineering pipeline.

Mastery Across Industry-Standard Toolchains

We seamlessly plug into your existing EDA workflows and foundry design environments.

Synopsys Flow

  • Design Compiler (DC Topo)
  • Fusion Compiler (FC / RTL-to-GDSII)
  • PrimeTime (STA & Signoff)
  • VCS / VC Formal / SpyGlass

Cadence Flow

  • Genus Synthesis Solution
  • Innovus Implementation System
  • Tempus Timing Signoff
  • Xcelium Logic Simulator / JasperGold

Siemens, Ansys & Foundry PDKs

  • Siemens Calibre nmDRC / nmLVS / PERC / PEX
  • Ansys RedHawk & RedHawk-SC (IR Drop & EM)
  • Siemens Questa Advanced Simulator & VIP
  • TSMC, Samsung, Intel IFS & GF PDKs (2nm-28nm)

Partner With Our Semiconductor Experts

Ready to discuss your SoC architecture or tape-out schedule? Connect with our technical leadership today.

Request Technical Briefing