Flawless Netlist-to-GDSII backend execution: hierarchical floorplanning, low-skew CTS, multi-corner STA timing closure, and DRC/LVS foundry signoff down to 5nm FinFET.
Shrinking process geometries introduce severe physical design challenges: on-chip variation (OCV), electromigration (EM), IR drop, signal integrity (crosstalk delay and noise), and complex design rule checks (DRC).
Power Silicon Technologies possesses extensive tape-out experience in leading foundry nodes from TSMC, Samsung, GlobalFoundries, and Intel. We utilize Synopsys Fusion Compiler and Cadence Innovus to deliver optimal Power, Performance, and Area (PPA) with zero design rule violations.
PD Step 01
Hierarchical partitioning, macro and standard cell placement optimization, IO pin assignment, and low-impedance power mesh design (VDD/VSS).
PD Step 02
Advanced Clock Tree Synthesis (CTS) utilizing multi-source CTS, mesh trees, and clock concurrent optimization (CCOpt) for minimum skew.
PD Step 03
Crosstalk-aware detailed routing, timing ECO generation, SI (Signal Integrity) glitch prevention, and final multi-mode multi-corner (MMMC) closure.