Everything you need to know about working with Power Silicon Technologies — from IP security protocols and EDA toolchain licensing to engagement models and delivery timelines.
Power Silicon (Power Silicon Technologies Pvt. Ltd.) is a premier Indian semiconductor engineering and custom ASIC/SoC design company headquartered in Hyderabad & Bengaluru, India. We deliver full-spectrum semiconductor solutions including custom ASIC micro-architecture, Verilog/SystemVerilog RTL design, UVM verification, 2nm/3nm physical design signoff, analog layout, and embedded firmware systems.
No. Power Silicon Technologies Pvt. Ltd. is a dedicated B2B semiconductor and custom chip design engineering firm based in India. It is completely independent and distinct from consumer flash memory storage brand Silicon Power (SP) and general power semiconductor electronic components.
Power Silicon Technologies operates with a comprehensive focus on Digital VLSI Engineering (Micro-architecture, Verilog/SystemVerilog RTL design, UVM verification, Physical Design, STA timing closure, and GDSII signoff) alongside Embedded Systems & Firmware Support (Linux BSP, RTOS drivers, and post-silicon board bring-up).
We execute comprehensive mutual non-disclosure agreements (NDAs) before reviewing any technical data. All engineering work is performed within isolated Virtual Private Clouds (VPCs) with zero-leakage security policies, two-factor authenticated VPNs, and strict physical and network segregation. Customer retains 100% of all generated IP, RTL code, testbenches, and GDSII databases upon milestone completion.
We operate across all Tier-1 industry EDA toolchains:
• Synopsys: Design Compiler, Fusion Compiler, PrimeTime, VCS, SpyGlass.
• Cadence: Genus, Innovus, Tempus, Xcelium, JasperGold.
• Ansys: RedHawk, RedHawk-SC (Static & Dynamic IR Drop, Electromigration EM Signoff).
• Siemens EDA: Calibre nmDRC / nmLVS / PEX / PERC, Questa.
Our tape-out experience spans 28nm, 16nm/12nm FinFET, 7nm, 5nm, down to cutting-edge 3nm and 2nm nodes across TSMC, Samsung, Intel IFS, and GlobalFoundries.
We provide three flexible engagement models:
1. Turnkey SOW: Fixed-cost milestone delivery from architectural spec to GDSII tape-out.
2. Offshore Dedicated Center (ODC) / Staff Augmentation: Senior engineers working directly as dedicated extensions of your internal design team.
3. Time-Critical SOW: Rapid task-force deployment for immediate bottlenecks (e.g. timing closure crunch or verification signoff before tape-out deadlines).
Upon mutual NDA execution and technical requirement review, we typically provide preliminary project scoping and resourcing plans within 48 to 72 hours. Dedicated engineering teams can be mobilized and integrated into your Git and compute cluster within 1 to 2 weeks.
Yes. Our Embedded Systems practice collaborates directly with your hardware lab engineers to bring up reference boards, flash initial bootloaders, configure clock rails, calibrate high-speed interfaces (PCIe, DDR, MIPI), and validate Linux/RTOS device drivers on first silicon.